当前位置: 主页-> MTK手机图片-> 金立ELIFE S7拆机图片

金立ELIFE S7拆机图片(0/0)

5秒

当前图集图片已浏览完毕

发布时间:2015-03-23 | 有0条评论

金立手机20日在澳门正式发布了自家最新超薄旗舰ELIFE S7--虽然这款手机早就开始在国内预约发售，S7的16G版售价为2499元，32G版售2799元，定价上超越了ELIFE S5.5以及S5.1。

价格上升的同时，ELIFE S7带来的直观升级是保证同样纤薄身材的同时，采用更好的硬件，该机拥有5.2英寸1080P三星Super AMOLED屏幕、MT6752八核64位处理器、2GB运存以及IMX214规模式摄像头，电池亦变了，达到了2750毫安，支持双4G双卡双待。

这些表面参数之外，内在做工、材质是否相应有升级？这组ELIFE S7拆机评测图片或许有答案。（via）

<< 上一图集

下一图集 >>

外观上，ELIF S7依旧选择了双面康宁大猩猩3代玻璃+金属中框的结构，正反面都有玻璃覆盖。: /uploads/allimg/150323/1-150323123517.jpg; /uploads/allimg/150323/1-150323123517.jpg; /uploads/allimg/150323/1-150323123517.jpg; 1

背面的玻璃以双面胶与机身紧密沾在一起。: /uploads/allimg/150323/1-150323123521.jpg; /uploads/allimg/150323/1-150323123521.jpg; /uploads/allimg/150323/1-150323123521.jpg; 2

要拆下玻璃必须先加热。: /uploads/allimg/150323/1-150323123523.jpg; /uploads/allimg/150323/1-150323123523.jpg; /uploads/allimg/150323/1-150323123523.jpg; 3

然后用吸盘拉起玻璃后壳。: /uploads/allimg/150323/1-150323123525.jpg; /uploads/allimg/150323/1-150323123525.jpg; /uploads/allimg/150323/1-150323123525.jpg; 4

后盖与机身有了缝隙之后，用拨片就可以正常分离了。: /uploads/allimg/150323/1-150323123527.jpg; /uploads/allimg/150323/1-150323123527.jpg; /uploads/allimg/150323/1-150323123527.jpg; 5

后壳分离之后。: /uploads/allimg/150323/1-150323123530.jpg; /uploads/allimg/150323/1-150323123530.jpg; /uploads/allimg/150323/1-150323123530.jpg; 6

硕大的内置式电池: /uploads/allimg/150323/1-150323123534.jpg; /uploads/allimg/150323/1-150323123534.jpg; /uploads/allimg/150323/1-150323123534.jpg; 7

薄至5.5mm的S7电池容量达到了2750毫安，十分难能可贵。: /uploads/allimg/150323/1-150323123537.jpg; /uploads/allimg/150323/1-150323123537.jpg; /uploads/allimg/150323/1-150323123537.jpg; 8

后壳上有利于散热的石墨膏。: /uploads/allimg/150323/1-150323123540.jpg; /uploads/allimg/150323/1-150323123540.jpg; /uploads/allimg/150323/1-150323123540.jpg; 9

电池下方集成了了喇叭、音腔、振动马达等元件，3.5mm标准耳机孔也位于该位置。: /uploads/allimg/150323/1-150323123544.jpg; /uploads/allimg/150323/1-150323123544.jpg; /uploads/allimg/150323/1-150323123544.jpg; 10

主PCB屏蔽罩上还加了铜膜来辅助芯片散热。: /uploads/allimg/150323/1-150323123547.jpg; /uploads/allimg/150323/1-150323123547.jpg; /uploads/allimg/150323/1-150323123547.jpg; 11

PCB板的背面同样采用硅脂提升手机散热性能。: /uploads/allimg/150323/1-150323123551.jpg; /uploads/allimg/150323/1-150323123551.jpg; /uploads/allimg/150323/1-150323123551.jpg; 12

S7采用了一体成型中框，为金属材质。: /uploads/allimg/150323/1-150323123554.jpg; /uploads/allimg/150323/1-150323123554.jpg; /uploads/allimg/150323/1-150323123554.jpg; 13

玻璃厚度仅0.4mm: /uploads/allimg/150323/1-150323123557.jpg; /uploads/allimg/150323/1-150323123557.jpg; /uploads/allimg/150323/1-150323123557.jpg; 14

集成了主要芯片的主板: /uploads/allimg/150323/1-150323123601.jpg; /uploads/allimg/150323/1-150323123601.jpg; /uploads/allimg/150323/1-150323123601.jpg; 15

主板背面有各式插槽与连接器。: /uploads/allimg/150323/1-150323123604.jpg; /uploads/allimg/150323/1-150323123604.jpg; /uploads/allimg/150323/1-150323123604.jpg; 16

S7主要的核心芯片一览。: /uploads/allimg/150323/1-150323123607.jpg; /uploads/allimg/150323/1-150323123607.jpg; /uploads/allimg/150323/1-150323123607.jpg; 17

联发科最新64位LTE八核芯片MT6752: /uploads/allimg/150323/1-150323123610.jpg; /uploads/allimg/150323/1-150323123610.jpg; /uploads/allimg/150323/1-150323123610.jpg; 18

三星2G RAM+16G ROM内存: /uploads/allimg/150323/1-150323123613.jpg; /uploads/allimg/150323/1-150323123613.jpg; /uploads/allimg/150323/1-150323123613.jpg; 19

MTK电源管理芯片MT6325V: /uploads/allimg/150323/1-150323123616.jpg; /uploads/allimg/150323/1-150323123616.jpg; /uploads/allimg/150323/1-150323123616.jpg; 20

MTK基带射频芯片MT6169: /uploads/allimg/150323/1-150323123619.jpg; /uploads/allimg/150323/1-150323123619.jpg; /uploads/allimg/150323/1-150323123619.jpg; 21

多合一无线连接芯片MT6625: /uploads/allimg/150323/1-150323123622.jpg; /uploads/allimg/150323/1-150323123622.jpg; /uploads/allimg/150323/1-150323123622.jpg; 22

射频放大器模块SKY77621: /uploads/allimg/150323/1-150323123626.jpg; /uploads/allimg/150323/1-150323123626.jpg; /uploads/allimg/150323/1-150323123626.jpg; 23

MTK电源管理芯片MT6311: /uploads/allimg/150323/1-150323123629.jpg; /uploads/allimg/150323/1-150323123629.jpg; /uploads/allimg/150323/1-150323123629.jpg; 24

500万与1300万像素摄像头模组: /uploads/allimg/150323/1-150323123632.jpg; /uploads/allimg/150323/1-150323123632.jpg; /uploads/allimg/150323/1-150323123632.jpg; 25

主摄模组厚度仅4.3mm: /uploads/allimg/150323/1-150323123635.jpg; /uploads/allimg/150323/1-150323123635.jpg; /uploads/allimg/150323/1-150323123635.jpg; 26

通过对金立ELIFE S7的拆解可以看到这台手机的做工用料都是非常出色，前后超薄玻璃加上铝合金一体形成铝合金中框，特别定制的耳机接口和摄像头，超薄的PCB，这些都能大大降低手机的厚度，同时拥有2750毫安电池大大提升手机续航能力，可见金立ELIFE S7不再为薄而薄，而是做到薄的同时兼顾了手机性能、续航、拍照和手感各方面。: /uploads/allimg/150323/1-150323123638.jpg; /uploads/allimg/150323/1-150323123638.jpg; /uploads/allimg/150323/1-150323123638.jpg; 27